The plastic Ball Grid Array (BGA) and Low profile Fine pitch BGA (LFBGA) packages have developed over recent years from being rarely used devices, to become, for many applications, the first choice ...
An advanced packaging technology has been developed that allows the mechanical stacking of chip-scale memory devices using a fine-pitch ball grid array (FBGA) interface. Significantly reducing ...
San Jose, Calif. – Taking aim at new socket requirements for fine-pitch ball-grid arrays, Yamaichi Electronics USA Inc. has launched an open-top 0.5-mm fine-pitch BGA socket as part of the IC398 ...
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