Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

Over the past few decades, various control disciplines like process, batch, motion and discrete control have been consolidated into a single, common automation architecture. This integration has ...

When it comes to process-control systems, reliability is crucial and failure can be costly or dangerous. A combination of good design practices, component selection, and testing can enhance ...

Dynamic optimisation and model predictive control (MPC) are at the forefront of modern process systems engineering, offering robust methodologies to address the challenges posed by time-varying ...