OSAKA, Japan--(BUSINESS WIRE)--Panasonic Corporation today announced that it developed a semiconductor encapsulation material for power devices that boasts the industry's top-class *1 heat-resistance ...

Start-up semiconductor packaging supplier Ziptronix Inc. has developed a MEMS encapsulation process it said can reduce the high packaging costs that have delayed the acceptance of MEMS technology. The ...

Irvine, CA – Henkel recently announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market's most demanding advanced packages, ...

Scientists from GIST developed, in a new study, high-efficiency, long-term stable organic semiconductor-based photocathodes that can be used to produce sustainable hydrogen via solar-driven water ...

With its superb electrical characteristics, silicon is at the heart of most semiconductors. Its ability to control electrical characteristics has made it essential in modern electronics. Three ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

The important materials making transient electronics a reality. The current challenges of transient electronics. How transient electronics could tackle e-waste. Electronics have long been defined by ...

Many of today’s technological advances center around semiconductors. They contribute to almost all of their utilities as well as real performance. To produce the powerful tech, a number of ...