Recent research has focused on the advantages and challenges associated with copper wire bonding, including its mechanical properties, corrosion resistance, and the formation of intermetallic ...
This last property is crucial in forming a good intermetallic compound (IMC ... used types of lead-free solder are SnAgCu (tin-silver-copper, also called SAC) and SnCu (tin-copper).
Aim-listed tin exploration company Rome Resources has confirmed significant widths of tin mineralisation from the first two ...