Based on the OPEN alliance 10BASE-T1S PHY, E2B bus aims at removing the need for MCUs centralizing software to HPC or central ...
UC Berkeley develops new 3D printing platform - called CPD - to enable the production of advanced antenna systems.
SDVs are booming, but designing hardware that can run software updates a decade in the future is a huge challenge.
IT giants eye up opportunities in software-defined vehicle sector with offering designed to drive down total cost of ...
Texas Instruments released new automotive chips focused on in-cabin sensing and audio processing. The AWRL6844 60GHz ...
Intel Corp (NASDAQ:INTC) showcased an expanded product portfolio and new partnerships to accelerate automakers’ transitions ...
1d
At CES 2025, Intel unveiled an expanded product portfolio designed to accelerate automakers’ transitions to electric and ...
Leading processor and AI graphics processing unit provider join forces to advance processing and connectivity in sector where ...
Automotive manufacturer Stellantis has partnered with dSPACE, a simulation and validation solutions provider, to expedite cloud-based development of its vehicles.
At CES, Intel (INTC) unveiled an expanded product portfolio and new partnerships designed to accelerate automakers’ ...
At CES 2025, Intel unveiled an expanded product portfolio designed to accelerate automakers’ transitions to electric and ...
TI’s automotive SoC releases for CES 2025 this year: a radar sensor for passenger safety, new audio processor solutions, and ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback