The effects of under bump metallurgy (UBM) microstructures on the intermetallic compound (IMC) growth of electroplated and stencil printed eutectic Sn-Pb solder bumps were investigated. The process ...

In this study, thermo-elastic and lattice dynamic properties of XMgAl (X = Li, Na) half-Heusler compounds are investigated using density functional theory implemented in WIEN2k and Quantum ESPRESSO ...

The environmentally conscious manufacturer is moving toward 'green products' for electronic devices and components. In this paper we investigate the interfacial reactions of Sn0.7Cu solder on ...

Continuously improving chip integration and increasing packaging density increase the risk of performance degradation and electromigration (EM) failure on the bonding interface during electrical ...

The influence of fuel molecules on the stability of the ordered intermetallic PtBi and PtPb phases has been extensively studied by synchrotron-based in situ X-ray grazing incidence diffraction under ...