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TSMC has broken ground on its third semiconductor fabrication plant in Arizona, marking a major expansion of its U.S.

Following CHIPS act funding, Apple's iPhone processor manufacturer TSMC has continued its Arizona investment with the company ...

TSMC breaks ground for its third Fab 21 module in the U.S., which will produce chips on A16 and N2 process technologies ...

Taiwan Semiconductor Manufacturing ( NYSE: TSM) held a groundbreaking ceremony for its third fab in Arizona, as the world's ...

Taiwan Semiconductor Manufacturing marks another milestone as it breaks ground on third Phoenix factory with Commerce Secretary Lutnick attending.

Taiwan Semiconductor Manufacturing Co. has begun construction on a third chip plant in Arizona, ramping up its US expansion ...

In a press release about TSMC breaking ground on a new Arizona chip fab, the Commerce Department quotes Cook: > “We’re proud to support the high-skilled American jobs of tomorrow. As TSMC Arizona’s ...

Taiwan Semiconductor Manufacturing Co. (NYSE:TSM), the worlds largest contract chipmaker, has officially broken ground on its third semiconductor fabrication plant in Phoenix, Arizona. This marks a ...

Apple has reaffirmed its commitment to making chips in the United States as Taiwan Semiconductor Manufacturing Company (TSMC) ...

Taiwan Semiconductor Manufacturing Co. (TSMC) has broken ground on the third semiconductor manufacturing facility at its campus in Phoenix, Arizona. Under the Investment Accelerator Program, the third ...

TSMC on Wednesday officially started building its third semiconductor facility — Fab 21 phase 3 — near Phoenix, Arizona ... Howard Lutnick visited the location, which is frequently described ...