Make large-scale simulations smarter and faster, up to 300X faster in some cases, for an improved return on software, hardware, human resources, and other investments.
A new technical paper titled “Hybrid surface pre-treatments for enhancing copper-to-copper direct bonding” was published by researchers at National Chung Hsing University (NCHU) and Osaka University.
Information Flow Verification at the Pre-silicon Stage Utilizing Static-Formal Methodology.” Abstract “Modern system-on-chips (SoCs) are becoming prone to numerous security vulnerabilities due to ...
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