Headquartered near Stuttgart, Germany, TES Electronic Solutions GmbH serves a global customer base, with design operations in Stuttgart and graphics IP development in Hamburg. Learn more at ...
FinFET technology enabled lower leakage, reduced short-channel effects, and better performance at reduced voltages. It successfully extended CMOS scaling from the 22nm node through the 7nm generation ...
At the show, EnSilica will demonstrate how complex system requirements are translated into production-ready ASICs, covering system architecture, mixed-signal and RF design, verification, test, ...
Fraunhofer IPMS develops new 10G TSN endpoint IP Core for deterministic high-speed Ethernet networks
As part of the CeCas funding project, Fraunhofer IPMS is developing a supercomputing platform for highly automated automobiles and testing 25G TSN solutions. In addition to the new 10G TSN-EP IP Core, ...
South Korean radar specialist bitsensing has launched an aftermarket ADAS aimed at upgrading existing buses, trucks and heavy goods vehicles with advanced driver warning functions. The ADAS Kit ...
GF’s industry-leading FDX platform is ideally suited for applications in Physical AI that are optimized for long battery life in small form factors, thanks to its ultra-low power and low leakage ...
Global semiconductor sales surged to a new high in 2025, underscoring the scale and speed of the industry’s rebound. According to the European Semiconductors Industry Association ( ESIA ), worldwide ...
SAN JOSE, Calif. – Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced the appointment of Victor Peng to its Board of Directors, effective ...
Akida FPGA Cloud service provides a pre-configured environment where designers can upload their models—created using standard frameworks like TensorFlow/Keras and PyTorch via the MetaTF™ software flow ...
According to the organization’s 2025 Annual Report, RISC-V’s market share is expected to grow from 2.5% in 2021 to 33.7% by 2031. This rapid growth is driven by countries like China and India using ...
San Jose, CA / Santa Clara, CA – SmartDV and Mirabilis Design today announced a strategic collaboration to deliver system-level models of SmartDV IP, enabling SoC architects and system designers to ...
T2M will be participating in Embedded World 2026, from March 10 to 12, 2026, in Nuremberg, Germany, to showcase its full range of production-proven RISC-V CPU IP cores. Extracted from silicon and ...
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