UC Berkeley develops new 3D printing platform - called CPD - to enable the production of advanced antenna systems.

SDVs are booming, but designing hardware that can run software updates a decade in the future is a huge challenge.

Texas Instruments released new automotive chips focused on in-cabin sensing and audio processing. The AWRL6844 60GHz ...

Intel showcased its expanded product portfolio and partnerships for electric and software-defined vehicles at CES 2025, ...

At CES 2025, Intel unveiled an expanded product portfolio designed to accelerate automakers’ transitions to electric and ...

Leading processor and AI graphics processing unit provider join forces to advance processing and connectivity in sector where ...

Automotive manufacturer Stellantis has partnered with dSPACE, a simulation and validation solutions provider, to expedite cloud-based development of its vehicles.

About Intel's System-Level Advantage: Intel's whole-vehicle approach delivers numerous benefits to automakers, including cost ...

Toyota announced at CES 2025 that its next-generation vehicles will have automated driving capabilities powered by Nvidia’s ...

TI’s automotive SoC releases for CES 2025 this year: a radar sensor for passenger safety, new audio processor solutions, and ...

Real-Time Innovations (RTI), the infrastructure software company for smart-world systems, today announced XPENG has selected ...