The effects of under bump metallurgy (UBM) microstructures on the intermetallic compound (IMC) growth of electroplated and stencil printed eutectic Sn-Pb solder bumps were investigated. The process ...

The direct conversion of CO2 to CH3OH represents an appealing strategy for the mitigation of anthropogenic CO2 emissions. Here, we report that small, narrowly distributed alloyed PdGa nanoparticles, ...