IGMTLSV03A is a synchronous ULVT periphery high-density ternary content addressable memory (TCAM). It is developed with TSMC 16nm 0.8V/1.8V CMOS LOGIC FinFET Compact process. Different combinations ..

IGMTLSY01A is a synchronous LVTLL / LVT / ULVT periphery high-density ternary content addressable memory (TCAM) with column redundancy feature. It is developed with TSMC 5nm 0.75V/1.2V CMOS ...

The story of the battle for semiconductors was the battle between Liang Mong Song of SMIC /Samsung vs Morris Chang of TSMC ...

When combined with 5nm (32%) and 7nm (17%) contributions, advanced nodes now account for 69% of total wafer revenue. This technology mix is crucial because it showcases TSMC's unmatched ...

TSMC is leveraging strong demand for sub-7nm advanced processes and its exclusive CoWoS packaging services, emerging as the leading beneficiary of the AI boom in 2024. Despite a slow recovery in ...

In Q3, 69% of TSMC's revenues came from the sales of 7nm, 5nm, and 3nm chips. The inability to sell 7nm and chips with smaller nodes to the Chinese clients could affect TSMC's performance in the ...

In November, Commerce finalized a $6.6 billion grant to TSMC's U.S. unit for semiconductor production in Phoenix, Arizona. "For the first time ever in our country's history, we are making leading ...

Taiwan Semiconductor Manufacturing Co (TSMC) has commenced the production of “advanced” four-nanometre chips in Arizona, US, Reuters reported citing US Commerce Secretary Gina Raimondo.

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Taiwan Semiconductor Manufacturing Company (TSMC) ended its relationship with PowerAIR, a low-key Singaporean firm, following a client check triggered by the discovery of a TSMC chip in a Huawei ...